Thin Film and Surface Analysis
In thin-film and surface analysis, LISA+ offers various possibilities for surface imaging, layer thickness control and determination of the topography. In addition, thin layers can be analyzed for their composition, element distribution and chemical bonds. We also have equipment for electrical characterization.
Our imaging methods include
- scanning electron microscopy
- scanning ion microscopy,
- and optical microscopy.
The topography and layer thickness measurement is carried out by means of
- scanning force microscopy,
- optical and tactile profilometry,
- and monochromatic ellipsometry.
For elemental analysis we offer equipment for
- Auger electron spectroscopy,
- energy dispersive X-ray spectroscopy,
- photoelectron spectroscopy,
- fourier-transform infrared spectroscopy,
- UV/Vis fluorescence & transmission spectroscopy,
- Raman spectroscopy,
- mass spectrometry with atmospheric probe, and
- Gas Chromatography-Mass Spectrometry (GC/MS) coupling.
The structural and phase analysis is carried out mainly via
- 4-circle X-ray diffractometer (XRD),
- spectroscopic ellipsometry,
- scanning tunneling microscopy
- and contact angle measurements.
LISA+ offers a variety of equipment for electrical characterization:
- FIB/HIM micromanipulators,
- probe stations,
- wire bonder, and
- parallel gap welding.